LCD wafer cutting wire 0.25

Diamond cutting wire is a new products by our own research and development.The quality of product has reached the world leading level. Products are used in cutting supplies supporting the manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive. For precise cutting various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on. LCD wafer cutting wire Technical parameters:1, Diameter: 0.12 0.36mm, diameter deviation ≤ 0.01mm2, Bus Material: high strength steel wire cutting3, Grit size of diamond: 5μm 60μm, we can design according to the customer's requirements4, The tensile strength: 3200 3400Mpa5, Wire length: we can processing according to user's requirements